Although rising demand for microchips has made it necessary for semiconductor capital equipment manufacturers to expand production, the process of building, shipping, installing, and commissioning new manufacturing lines capable of meeting modern precision requirements is technically challenging, time consuming, and expensive. These lines are also often dependent on slow and inefficient supply chains, making them vulnerable to unanticipated issues that can extend product development cycles and result in lead times as long as six to nine months for additional tooling.

In this executive brief, you will learn how 3D Systems is helping semiconductor capital equipment manufacturers incorporate metal additive manufacturing (AM) into their manufacturing processes to improve imaging performance, yield, quality, accuracy, productivity, and reliability.